Features: EDSFF Advantages: Our PCI-E 4.0 4X Host Adapter unlocks the dynamic range of form factors offered by EDSFF, providing significant advantages in capacity, scalability, performance, serviceability, manageability, thermal and power management compared to traditional SSD form factors. Compatibility and Heat Sink: Our adapter is specifically designed to connect GEN-Z SSDs in the E1.S form factor, including SSDs with heat sinks that are 9.5mm, 15mm, and 25mm in thickness (such as PM9A3 PM9D3 P5801X). The heat sink ensures efficient heat dissipation for optimal performance. Easy Installation: This converter can be seamlessly installed internally into your system through the PCI-E 4X interface, allowing you to upgrade your storage without hassle. Wide Applications: By converting an EDSFF E1.S SSD into a PCI-E SSD, our adapter opens up possibilities for usage in IoT, data centers, and server areas, enabling fast and reliable data storage and retrieval. Plug-and-Play: Our adapter is compliant with PCI Express 4.0, offering fast and reliable data transfer speeds. It requires no driver installation, and most of the latest operating systems support PCIe-NVMe SSDs, ensuring compatibility with your existing setup. WERLEO PCI-E 4.0 4X Host Converter to EDSFF GEN-Z NVMe Ruler 1U E1.S 9.5mm 15mm 25mm Thickness Short SSD with Heat Sink PM9A3 Carrier Adapter: This converter enables the connection of a GEN-Z SSD in E1.S. Fit for 9.5mm & 15mm & 25mm thickness SSD with heat sink.(like PM9A3 PM9D3 P5801X) The converter can be installed into your system internally through the PCI-E 4X interface. Thus an EDSFF E1.S SSD becomes an PCI-E SSD, which can be used in IoT, data center and server area. Compliant with PCI Express 4.0. No driver installation is required. Most of the latest operating systems support PCIe-NVMe SSDs. Low profile and Regular size PCIe bracket on board. EDSFF offers a dynamic range of form factors that have advantages vs the incumbent SSD form factors in capacity, scalability, performance, serviceability, manageability, thermal and power management.