This listing contains 10 pieces of the 1SS302 device in the SC70 package with TE85L,F marking. The component is provided for surfacemount assembly and offers a compact form factor suitable for modern, spaceconstrained PCBs. Key benefits Spacesaving SC70 package enables higher component density and smaller overall board size. Known part number 1SS302 with traceable TE85L,F marking supports quality control and supplier verification. Designed for standard SMT processes, facilitating easy integration into existing assembly lines. Key attributes Model: 1SS302 Quantity: 10 pieces Package: SC70 Marking: TE85L, F Compatibility: Suitable for standard surfacemount technology and land patterns for SC70 devices Size: SC70 small form factor for compact PCB designs Functionality: 1SS302 device provided in a compact SC70 form factor Performance: Intended for reliable operation within typical SMT usage contexts (specific electrical characteristics not specified here) Applications Use in compact consumer electronics, wearables, and IoT devices where board space is at a Replacement or stocking for SMT boards that employ SC70 packaged 1SS302 components Prototyping and development on dense PCBs, enabling efficient layout iterations and quick replacements Traceability TE85L,F marking provides manufacturing traceability for quality assurance and lot tracking Notes This description reflects the product title and known packaging details. No additional specifications are provided beyond the model, quantity, and packaging type.